Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818683 | Electronic package and method of fabricating the same | Kuang-Hsin Chen, Sheng-Li Lu, Hsien-Wen Chen | 2017-11-14 |
| 9754868 | Substrate structure, electronic package and method for fabricating the electronic package | Hsin-Chih Wang, Chih-Yuan Shih, Shih-Ching Chen | 2017-09-05 |
| 9748183 | Fabrication method of semiconductor package | Cheng-Hao Ciou, Cheng-Chieh Wu, Kuang-Hsin Chen, Hsien-Wen Chen | 2017-08-29 |
| 9627307 | Semiconductor package and fabrication method thereof | Cheng-Hao Ciou, Cheng-Chieh Wu, Kuang-Hsin Chen, Hsien-Wen Chen | 2017-04-18 |