Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754868 | Substrate structure, electronic package and method for fabricating the electronic package | Ching-Wen Chiang, Hsin-Chih Wang, Shih-Ching Chen | 2017-09-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754868 | Substrate structure, electronic package and method for fabricating the electronic package | Ching-Wen Chiang, Hsin-Chih Wang, Shih-Ching Chen | 2017-09-05 |