Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748183 | Fabrication method of semiconductor package | Ching-Wen Chiang, Cheng-Chieh Wu, Kuang-Hsin Chen, Hsien-Wen Chen | 2017-08-29 |
| 9627307 | Semiconductor package and fabrication method thereof | Ching-Wen Chiang, Cheng-Chieh Wu, Kuang-Hsin Chen, Hsien-Wen Chen | 2017-04-18 |