Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793234 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsing-Lung SHEN | 2017-10-17 |
| 9711425 | Sensing module and method for forming the same | Po-Chang Huang, Tsang-Yu Liu, Yu-Lung Huang, Chi-Chang Liao | 2017-07-18 |
| 9640488 | Chip package and method for forming the same | Yi-Min Lin, Yi-Ming Chang, Yen-Shih Ho, Tsang-Yu Liu, Chia-Ming Cheng | 2017-05-02 |
| 9601460 | Chip package including recess in side edge | Yen-Shih Ho, Tsang-Yu Liu, Chia-Sheng Lin, Chia-Ming Cheng, Tzu-Wen Tseng | 2017-03-21 |
| 9570398 | Chip package and method for forming the same | Yu-Ting Huang, Tsang-Yu Liu, Yen-Shih Ho | 2017-02-14 |
| 9548265 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsing-Lung SHEN, Yu-Hao SU, Kuan-Jung Wu, Yi-Hua Cheng | 2017-01-17 |