Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711425 | Sensing module and method for forming the same | Shu-Ming Chang, Po-Chang Huang, Tsang-Yu Liu, Chi-Chang Liao | 2017-07-18 |
| 9620431 | Chip package including recess in side edge | Chia-Ming Cheng, Tsang-Yu Liu, Chi-Chang Liao | 2017-04-11 |