Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853074 | Chip scale sensing chip package | Ho-Yin Yiu, Shih-Yi LEE, Yen-Kang Raw | 2017-12-26 |
| 9711425 | Sensing module and method for forming the same | Shu-Ming Chang, Po-Chang Huang, Tsang-Yu Liu, Yu-Lung Huang | 2017-07-18 |
| 9620431 | Chip package including recess in side edge | Chia-Ming Cheng, Tsang-Yu Liu, Yu-Lung Huang | 2017-04-11 |