Issued Patents 2017
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780251 | Semiconductor structure and manufacturing method thereof | Wei-Luen SUEN, Wei-Ming CHIEN, Po-Han Lee, Yen-Shih Ho | 2017-10-03 |
| 9711425 | Sensing module and method for forming the same | Shu-Ming Chang, Po-Chang Huang, Yu-Lung Huang, Chi-Chang Liao | 2017-07-18 |
| 9711403 | Method for forming chip package | Chien-Hui Chen, Ming-Kun Yang, Yen-Shih Ho | 2017-07-18 |
| 9685354 | Separation apparatus and a method for separating a cap layer from a chip package by means of the separation apparatus | Yen-Shih Ho, Chia-Sheng Lin, Yi-Ming Chang | 2017-06-20 |
| 9653422 | Chip package and method for forming the same | Chia-Lun SHEN, Yi-Ming Chang, Yen-Shih Ho | 2017-05-16 |
| 9640488 | Chip package and method for forming the same | Yi-Min Lin, Yi-Ming Chang, Shu-Ming Chang, Yen-Shih Ho, Chia-Ming Cheng | 2017-05-02 |
| 9640683 | Electrical contact structure with a redistribution layer connected to a stud | Wei-Luen SUEN, Wei-Ming CHIEN, Po-Han Lee, Yen-Shih Ho | 2017-05-02 |
| 9633935 | Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same | Yen-Shih Ho, Chih-Wei Ho | 2017-04-25 |
| 9620431 | Chip package including recess in side edge | Chia-Ming Cheng, Chi-Chang Liao, Yu-Lung Huang | 2017-04-11 |
| 9613919 | Chip package and method for forming the same | Po-Han Lee, Wei-Ming CHIEN | 2017-04-04 |
| 9611143 | Method for forming chip package | Yen-Shih Ho, Chia-Sheng Lin, Yi-Ming Chang | 2017-04-04 |
| 9601460 | Chip package including recess in side edge | Yen-Shih Ho, Chia-Sheng Lin, Chia-Ming Cheng, Shu-Ming Chang, Tzu-Wen Tseng | 2017-03-21 |
| 9570398 | Chip package and method for forming the same | Shu-Ming Chang, Yu-Ting Huang, Yen-Shih Ho | 2017-02-14 |
| 9559001 | Chip package and method for forming the same | Yu-Lin Yen, Ming-Kun Yang, Long-Sheng Yeou | 2017-01-31 |