Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559001 | Chip package and method for forming the same | Yu-Lin Yen, Ming-Kun Yang, Tsang-Yu Liu | 2017-01-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559001 | Chip package and method for forming the same | Yu-Lin Yen, Ming-Kun Yang, Tsang-Yu Liu | 2017-01-31 |