Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559001 | Chip package and method for forming the same | Ming-Kun Yang, Tsang-Yu Liu, Long-Sheng Yeou | 2017-01-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559001 | Chip package and method for forming the same | Ming-Kun Yang, Tsang-Yu Liu, Long-Sheng Yeou | 2017-01-31 |