MY

Ming-Kun Yang

XI Xintec: 2 patents #14 of 44Top 35%
📍 Pingzhen District, TW: #5 of 44 inventorsTop 15%
Overall (2017): #121,362 of 506,227Top 25%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9711403 Method for forming chip package Chien-Hui Chen, Tsang-Yu Liu, Yen-Shih Ho 2017-07-18
9559001 Chip package and method for forming the same Yu-Lin Yen, Tsang-Yu Liu, Long-Sheng Yeou 2017-01-31