Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711403 | Method for forming chip package | Chien-Hui Chen, Tsang-Yu Liu, Yen-Shih Ho | 2017-07-18 |
| 9559001 | Chip package and method for forming the same | Yu-Lin Yen, Tsang-Yu Liu, Long-Sheng Yeou | 2017-01-31 |