Issued Patents 2017
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793234 | Chip package and manufacturing method thereof | Shu-Ming Chang, Hsing-Lung SHEN | 2017-10-17 |
| 9780251 | Semiconductor structure and manufacturing method thereof | Wei-Luen SUEN, Wei-Ming CHIEN, Po-Han Lee, Tsang-Yu Liu | 2017-10-03 |
| 9761555 | Passive component structure and manufacturing method thereof | Jiun-Yen LAI, Yu-Wen Hu, Bai-Yao Lou, Chia-Sheng Lin, Hsin Kuan | 2017-09-12 |
| 9711403 | Method for forming chip package | Chien-Hui Chen, Ming-Kun Yang, Tsang-Yu Liu | 2017-07-18 |
| 9685354 | Separation apparatus and a method for separating a cap layer from a chip package by means of the separation apparatus | Tsang-Yu Liu, Chia-Sheng Lin, Yi-Ming Chang | 2017-06-20 |
| 9653422 | Chip package and method for forming the same | Chia-Lun SHEN, Yi-Ming Chang, Tsang-Yu Liu | 2017-05-16 |
| 9640683 | Electrical contact structure with a redistribution layer connected to a stud | Wei-Luen SUEN, Wei-Ming CHIEN, Po-Han Lee, Tsang-Yu Liu | 2017-05-02 |
| 9640488 | Chip package and method for forming the same | Yi-Min Lin, Yi-Ming Chang, Shu-Ming Chang, Tsang-Yu Liu, Chia-Ming Cheng | 2017-05-02 |
| 9633935 | Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same | Chih-Wei Ho, Tsang-Yu Liu | 2017-04-25 |
| 9613904 | Semiconductor structure and manufacturing method thereof | Yu-Tung Chen, Chien-Min Lin, Chuan-Jin Shiu, Chih-Wei Ho | 2017-04-04 |
| 9611143 | Method for forming chip package | Tsang-Yu Liu, Chia-Sheng Lin, Yi-Ming Chang | 2017-04-04 |
| 9601460 | Chip package including recess in side edge | Tsang-Yu Liu, Chia-Sheng Lin, Chia-Ming Cheng, Shu-Ming Chang, Tzu-Wen Tseng | 2017-03-21 |
| 9570398 | Chip package and method for forming the same | Shu-Ming Chang, Yu-Ting Huang, Tsang-Yu Liu | 2017-02-14 |
| 9548265 | Chip package and manufacturing method thereof | Shu-Ming Chang, Hsing-Lung SHEN, Yu-Hao SU, Kuan-Jung Wu, Yi-Hua Cheng | 2017-01-17 |