KW

Kuan-Jung Wu

XI Xintec: 1 patents #21 of 44Top 50%
Overall (2017): #339,985 of 506,227Top 70%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9548265 Chip package and manufacturing method thereof Yen-Shih Ho, Shu-Ming Chang, Hsing-Lung SHEN, Yu-Hao SU, Yi-Hua Cheng 2017-01-17