Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548265 | Chip package and manufacturing method thereof | Yen-Shih Ho, Shu-Ming Chang, Hsing-Lung SHEN, Kuan-Jung Wu, Yi-Hua Cheng | 2017-01-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548265 | Chip package and manufacturing method thereof | Yen-Shih Ho, Shu-Ming Chang, Hsing-Lung SHEN, Kuan-Jung Wu, Yi-Hua Cheng | 2017-01-17 |