Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793234 | Chip package and manufacturing method thereof | Yen-Shih Ho, Shu-Ming Chang | 2017-10-17 |
| 9548265 | Chip package and manufacturing method thereof | Yen-Shih Ho, Shu-Ming Chang, Yu-Hao SU, Kuan-Jung Wu, Yi-Hua Cheng | 2017-01-17 |