YC

Yi-Hua Cheng

XI Xintec: 1 patents #21 of 44Top 50%
📍 Dingshanjiao, TW: #3 of 8 inventorsTop 40%
Overall (2017): #189,767 of 506,227Top 40%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9548265 Chip package and manufacturing method thereof Yen-Shih Ho, Shu-Ming Chang, Hsing-Lung SHEN, Yu-Hao SU, Kuan-Jung Wu 2017-01-17