Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711469 | Semiconductor structure having recess and manufacturing method thereof | Geng-Peng PAN, Chia-Sheng Lin | 2017-07-18 |
| 9685354 | Separation apparatus and a method for separating a cap layer from a chip package by means of the separation apparatus | Yen-Shih Ho, Tsang-Yu Liu, Chia-Sheng Lin | 2017-06-20 |
| 9653422 | Chip package and method for forming the same | Chia-Lun SHEN, Tsang-Yu Liu, Yen-Shih Ho | 2017-05-16 |
| 9640488 | Chip package and method for forming the same | Yi-Min Lin, Shu-Ming Chang, Yen-Shih Ho, Tsang-Yu Liu, Chia-Ming Cheng | 2017-05-02 |
| 9611143 | Method for forming chip package | Yen-Shih Ho, Tsang-Yu Liu, Chia-Sheng Lin | 2017-04-04 |