Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780251 | Semiconductor structure and manufacturing method thereof | Wei-Luen SUEN, Wei-Ming CHIEN, Tsang-Yu Liu, Yen-Shih Ho | 2017-10-03 |
| 9640683 | Electrical contact structure with a redistribution layer connected to a stud | Wei-Luen SUEN, Wei-Ming CHIEN, Tsang-Yu Liu, Yen-Shih Ho | 2017-05-02 |
| 9613919 | Chip package and method for forming the same | Tsang-Yu Liu, Wei-Ming CHIEN | 2017-04-04 |