Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853074 | Chip scale sensing chip package | Ho-Yin Yiu, Chi-Chang Liao, Yen-Kang Raw | 2017-12-26 |
| 9831185 | Chip package and fabrication method thereof | Ying-Nan Wen, Chien-Hung Liu, Ho-Yin Yiu | 2017-11-28 |
| 9780050 | Method of fabricating chip package with laser | Ying-Nan Wen, Chien-Hung Liu, Ho-Yin Yiu | 2017-10-03 |
| 9768067 | Chip package and manufacturing method thereof | Chien-Hung Liu, Ying-Nan Wen, Ho-Yin Yiu | 2017-09-19 |
| 9721911 | Chip package and manufacturing method thereof | Ho-Yin Yiu, Ying-Nan Wen, Chien-Hung Liu | 2017-08-01 |
| 9640405 | Chip package having a laser stop structure | Ying-Nan Wen, Chien-Hung Liu, Ho-Yin Yiu | 2017-05-02 |
| 9543233 | Chip package having a dual through hole redistribution layer structure | Chien-Hung Liu, Ying-Nan Wen, Ho-Yin Yiu | 2017-01-10 |