Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853074 | Chip scale sensing chip package | Chi-Chang Liao, Shih-Yi LEE, Yen-Kang Raw | 2017-12-26 |
| 9831185 | Chip package and fabrication method thereof | Shih-Yi LEE, Ying-Nan Wen, Chien-Hung Liu | 2017-11-28 |
| 9812413 | Chip module and method for forming the same | Ying-Nan Wen, Chien-Hung Liu | 2017-11-07 |
| 9780050 | Method of fabricating chip package with laser | Ying-Nan Wen, Chien-Hung Liu, Shih-Yi LEE | 2017-10-03 |
| 9768067 | Chip package and manufacturing method thereof | Chien-Hung Liu, Ying-Nan Wen, Shih-Yi LEE | 2017-09-19 |
| 9721911 | Chip package and manufacturing method thereof | Ying-Nan Wen, Chien-Hung Liu, Shih-Yi LEE | 2017-08-01 |
| 9640405 | Chip package having a laser stop structure | Ying-Nan Wen, Chien-Hung Liu, Shih-Yi LEE | 2017-05-02 |
| 9543233 | Chip package having a dual through hole redistribution layer structure | Chien-Hung Liu, Ying-Nan Wen, Shih-Yi LEE | 2017-01-10 |