Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761558 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Wei-Shun Wang, Se Young Yang | 2017-09-12 |
| 9716075 | Semiconductor chip assembly and method for making same | Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira +3 more | 2017-07-25 |
| 9666450 | Substrate and assembly thereof with dielectric removal for increased post height | Kazuo Sakuma, Belgacem Haba | 2017-05-30 |