Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691731 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2017-06-27 |
| 9666450 | Substrate and assembly thereof with dielectric removal for increased post height | Philip Damberg, Belgacem Haba | 2017-05-30 |