IS

Il Kwon Shim

SC Stats Chippac: 13 patents #3 of 128Top 3%
Overall (2017): #4,165 of 506,227Top 1%
13
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9754897 Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits Yaojian Lin, Byung Joon Han, Rajendra D. Pendse, Pandi C. Marimuthu, Won Kyoung Choi +1 more 2017-09-05
9721922 Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package Pandi C. Marimuthu, Yaojian Lin, Won Kyoung Choi 2017-08-01
9721862 Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages Byung Joon Han, Yaojian Lin, Pandi C. Marimuthu 2017-08-01
9701534 Semiconductor device and method of forming MEMS package Yaojian Lin 2017-07-11
9704824 Semiconductor device and method of forming embedded wafer level chip scale packages Yaojian Lin, Pandi C. Marimuthu, Byung Joon Han 2017-07-11
9704780 Semiconductor device and method of forming low profile fan-out package with vertical interconnection units Pandi C. Marimuthu, Yaojian Lin, Won Kyoung Choi 2017-07-11
9666500 Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more 2017-05-30
9620413 Semiconductor device and method of using a standardized carrier in semiconductor packaging Thomas Strothmann, Damien M. Pricolo, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon +1 more 2017-04-11
9564413 Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus Byung Joon Han, Heap Hoe Kuan 2017-02-07
9559039 Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package Jun Mo Koo, Pandi C. Marimuthu, Yaojian Lin, See Chian Lim 2017-01-31
9559029 Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer Yaojian Lin, Seng Guan Chow 2017-01-31
9559004 Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy Byung Joon Han, Won Kyoung Choi 2017-01-31
9553162 Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus Thomas Strothmann, Steve Anderson, Byung Joon Han, Heap Hoe Kuan 2017-01-24