Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793169 | Methods for forming mask layers using a flowable carbon-containing silicon dioxide material | Huy Cao, Guillaume Bouche, Songkram Srivathanakul | 2017-10-17 |
| 9754837 | Controlling within-die uniformity using doped polishing material | Haigou Huang, Jinping Liu, Taifong Chao | 2017-09-05 |
| 9666476 | Dimension-controlled via formation processing | Xiang Hu, Yuping Ren, Duohui Bei, Sipeng Gu | 2017-05-30 |
| 9627274 | Methods of forming self-aligned contacts on FinFET devices | Haifeng Sheng, Xintuo Dai, Jinping Liu | 2017-04-18 |
| 9620381 | Facilitating etch processing of a thin film via partial implantation thereof | Suraj K. Patil, Huy Cao, Hui Zhan | 2017-04-11 |
| 9620380 | Methods for fabricating integrated circuits using self-aligned quadruple patterning | Xintuo Dai, Jin Ping Liu, Jiong Li | 2017-04-11 |
| 9606432 | Alternating space decomposition in circuit structure fabrication | Guoxiang Ning, Xintuo Dai, Chin Teong Lim | 2017-03-28 |
| 9595493 | Reducing liner corrosion during metallization of semiconductor devices | Zhiguo Sun, Qiang Fang, Haigou Huang, Jiehui Shu, Jin Ping Liu | 2017-03-14 |
| 9589807 | Method for eliminating interlayer dielectric dishing and controlling gate height uniformity | Haigou Huang, Jinping Liu, Yuanfang Lu | 2017-03-07 |