Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9817927 | Hard mask etch and dielectric etch aware overlap for via and metal layers | Guo Xiang Ning, Yuping Ren, David N. Power, Lalit Shokeen, Paul Ackmann +1 more | 2017-11-14 |
| 9817940 | Method wherein test cells and dummy cells are included into a layout of an integrated circuit | Guido Ueberreiter, Paul Ackmann, Guoxiang Ning, Jui-Hsuan Feng | 2017-11-14 |
| 9672312 | Method wherein test cells and dummy cells are included into a layout of an integrated circuit | Guido Ueberreiter, Paul Ackmann, Guoxiang Ning, Jui-Hsuan Feng | 2017-06-06 |
| 9672313 | Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of an IC device | Guoxiang Ning, Yuping Ren, Xusheng Wu, Paul Ackmann | 2017-06-06 |
| 9645486 | Multiple threshold convergent OPC model | Guoxiang Ning, Paul Ackmann | 2017-05-09 |
| 9606432 | Alternating space decomposition in circuit structure fabrication | Guoxiang Ning, Xintuo Dai, Huang Liu | 2017-03-28 |
| 9535319 | Reticle, system comprising a plurality of reticles and method for the formation thereof | Guido Ueberreiter, Guoxiang Ning, Jui-Hsuan Feng, Paul Ackmann | 2017-01-03 |