Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9817927 | Hard mask etch and dielectric etch aware overlap for via and metal layers | Guo Xiang Ning, Yuping Ren, David N. Power, Chin Teong Lim, Paul Ackmann +1 more | 2017-11-14 |