Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9817927 | Hard mask etch and dielectric etch aware overlap for via and metal layers | Guo Xiang Ning, David N. Power, Lalit Shokeen, Chin Teong Lim, Paul Ackmann +1 more | 2017-11-14 |
| 9672313 | Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of an IC device | Guoxiang Ning, Chin Teong Lim, Xusheng Wu, Paul Ackmann | 2017-06-06 |
| 9666476 | Dimension-controlled via formation processing | Xiang Hu, Duohui Bei, Sipeng Gu, Huang Liu | 2017-05-30 |