Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9817927 | Hard mask etch and dielectric etch aware overlap for via and metal layers | Guo Xiang Ning, Yuping Ren, David N. Power, Lalit Shokeen, Chin Teong Lim +1 more | 2017-11-14 |
| 9793358 | Non-planar semiconductor device with multiple-head epitaxial structure on fin | Xusheng Wu, Changyong Xiao, Wanxun He | 2017-10-17 |
| 9735154 | Semiconductor structure having gap fill dielectric layer disposed between fins | Andy Wei, Dae-Han Choi, Dae Geun Yang, Mariappan Hariharaputhiran | 2017-08-15 |
| 9666476 | Dimension-controlled via formation processing | Yuping Ren, Duohui Bei, Sipeng Gu, Huang Liu | 2017-05-30 |