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Thin, flexible microsystem with integrated energy source |
Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, John U. Knickerbocker, Eric P. Lewandowski +2 more |
2016-10-18 |
| 9343423 |
No flow underfill or wafer level underfill and solder columns |
Claudius Ferger, Jae-Woong Nah, Da-Yuan Shih |
2016-05-17 |
| 9321245 |
Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion |
Eric P. Lewandowski, Jae-Woong Nah, Robert J. Polastre |
2016-04-26 |
| 9305896 |
No flow underfill or wafer level underfill and solder columns |
Claudius Ferger, Jae-Woong Nah, Da-Yuan Shih |
2016-04-05 |
| 9272498 |
Precast thermal interface adhesive for easy and repeated, separation and remating |
Evan G. Colgan, Paul W. Coteus, Kenneth C. Marston, Steven P. Ostrander |
2016-03-01 |
| 9273408 |
Direct injection molded solder process for forming solder bumps on wafers |
Bing Dang, Paul A. Lauro, Jae-Woong Nah |
2016-03-01 |
