Issued Patents 2016
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9507086 | Optical I/O system using planar light-wave integrated circuit | Mauro J. Kobrinsky, Henning Braunisch, Shawna M. Liff, Peter L. D. Chang, Bruce A. Block | 2016-11-29 |
| 9445496 | Glass clad microelectronic substrate | Qing Ma | 2016-09-13 |
| 9429427 | Inductive inertial sensor architecture and fabrication in packaging build-up layers | Qing Ma, Feras Eid, Kevin Lin, Weng Hong Teh, Valluri Rao | 2016-08-30 |
| 9406618 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | John S. Guzek, Ravi Kiran Nalla, Javier Solo Gonzalez, Drew W. Delaney, Suresh Pothukuchi +2 more | 2016-08-02 |
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more | 2016-07-19 |
| 9374162 | Semiconductor package with optical port | Robert L. Sankman, Dmitri E. Nikonov, Raseong Kim | 2016-06-21 |
| 9368429 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Qing Ma, Min Tao, Charles A. Gealer, Edward A. Zarbock | 2016-06-14 |
| 9361059 | Architecture for seamless integrated display system | Uygar E. Avci, Islam A. Salama, Ravi Pallarisetty | 2016-06-07 |
| 9310565 | Cloaking system with waveguides | Ian A. Young, Robert L. Sankman, Marko Radosavljevic | 2016-04-12 |
| 9297824 | Techniques, systems and devices related to acceleration measurement | Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh +1 more | 2016-03-29 |
| 9275969 | Optical interconnect on bumpless build-up layer package | Feras Eid, Weng Hong Teh | 2016-03-01 |