| 9502288 |
Method of forming an interconnect structure |
Son V. Nguyen, Alfred Grill, Thomas J. Haigh, Jr., Tuan A. Vo |
2016-11-22 |
| 9490168 |
Via formation using sidewall image transfer process to define lateral dimension |
Shyng-Tsong Chen, Cheng Chi, Chi-Chun Liu, Sylvie Mignot, Yann Mignot +3 more |
2016-11-08 |
| 9472503 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects |
Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami +1 more |
2016-10-18 |
| 9455182 |
Interconnect structure with capping layer and barrier layer |
Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini |
2016-09-27 |
| 9449812 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication |
Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini +1 more |
2016-09-20 |
| 9449810 |
Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors |
Donald F. Canaperi, Son V. Nguyen, Deepika Priyadarshini |
2016-09-20 |
| 9312224 |
Interconnect structure containing a porous low k interconnect dielectric/dielectric cap |
Donald F. Canaperi, Alfred Grill, Thomas J. Haigh, Jr., Son V. Nguyen, Takeshi Nogami +2 more |
2016-04-12 |
| 9275952 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects |
Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami +1 more |
2016-03-01 |
