| 9515089 |
Bulk fin formation with vertical fin sidewall profile |
Kangguo Cheng, Hong He, Sivananda K. Kanakasabapathy, Yunpeng Yin |
2016-12-06 |
| 9508713 |
Densely spaced fins for semiconductor fin field effect transistors |
Hong He, Chun-Chen Yeh, Yunpeng Yin |
2016-11-29 |
| 9484440 |
Methods for forming FinFETs with non-merged epitaxial fin extensions |
Hong He, Shogo Mochizuki, Chun-Chen Yeh, Yunpeng Yin |
2016-11-01 |
| 9396957 |
Non-lithographic line pattern formation |
David V. Horak, Chun-Chen Yeh, Yunpeng Yin |
2016-07-19 |
| 9391155 |
Gate structure integration scheme for fin field effect transistors |
Hong He, Chun-Chen Yeh, Yunpeng Yin |
2016-07-12 |
| 9385123 |
STI region for small fin pitch in FinFET devices |
Hsueh-Chung Chen, Su Chen Fan, Chun-Chen Yeh |
2016-07-05 |
| 9368350 |
Tone inverted directed self-assembly (DSA) fin patterning |
Hong He, Chi-Chun Liu, Alexander Reznicek, Tenko Yamashita |
2016-06-14 |
| 9330962 |
Non-lithographic hole pattern formation |
David V. Horak, Chun-Chen Yeh, Yunpeng Yin |
2016-05-03 |
| 9324830 |
Self-aligned contact process enabled by low temperature |
Hong He, Chun-Chen Yeh, Yunpeng Yin |
2016-04-26 |
| 9293345 |
Sidewall image transfer with a spin-on hardmask |
Hong He, Chun-Chen Yeh, Yunpeng Yin |
2016-03-22 |
| 9252243 |
Gate structure integration scheme for fin field effect transistors |
Hong He, Chun-Chen Yeh, Yunpeng Yin |
2016-02-02 |
| 9245788 |
Non-bridging contact via structures in proximity |
Jin Liu, Lei Zhuang |
2016-01-26 |
