| 9496190 |
Feedback of layer thickness timing and clearance timing for polishing control |
Kun Xu, Feng Q. Liu, Boguslaw A. Swedek, Yuchun Wang, Wen-Chiang Tu +1 more |
2016-11-15 |
| 9490186 |
Limiting adjustment of polishing rates during substrate polishing |
Benjamin Cherian, Sivakumar Dhandapani, Harry Q. Lee |
2016-11-08 |
| 9375824 |
Adjustment of polishing rates during substrate polishing with predictive filters |
Benjamin Cherian, Sivakumar Dhandapani, Harry Q. Lee |
2016-06-28 |
| 9346146 |
Adjusting polishing rates by using spectrographic monitoring of a substrate during processing |
Jeffrey Drue David, Harry Q. Lee, Boguslaw A. Swedek |
2016-05-24 |
| 9308618 |
Linear prediction for filtering of data during in-situ monitoring of polishing |
— |
2016-04-12 |
| 9233450 |
Optical detection of metal layer clearance |
Jeffrey Drue David |
2016-01-12 |
| 9227293 |
Multi-platen multi-head polishing architecture |
Jeffrey Drue David, Boguslaw A. Swedek, Doyle E. Bennett, Thomas H. Osterheld, Benjamin Cherian +3 more |
2016-01-05 |
