Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496190 | Feedback of layer thickness timing and clearance timing for polishing control | Kun Xu, Feng Q. Liu, Boguslaw A. Swedek, Yuchun Wang, Wen-Chiang Tu +1 more | 2016-11-15 |
| 9490186 | Limiting adjustment of polishing rates during substrate polishing | Benjamin Cherian, Sivakumar Dhandapani, Harry Q. Lee | 2016-11-08 |
| 9375824 | Adjustment of polishing rates during substrate polishing with predictive filters | Benjamin Cherian, Sivakumar Dhandapani, Harry Q. Lee | 2016-06-28 |
| 9346146 | Adjusting polishing rates by using spectrographic monitoring of a substrate during processing | Jeffrey Drue David, Harry Q. Lee, Boguslaw A. Swedek | 2016-05-24 |
| 9308618 | Linear prediction for filtering of data during in-situ monitoring of polishing | — | 2016-04-12 |
| 9233450 | Optical detection of metal layer clearance | Jeffrey Drue David | 2016-01-12 |
| 9227293 | Multi-platen multi-head polishing architecture | Jeffrey Drue David, Boguslaw A. Swedek, Doyle E. Bennett, Thomas H. Osterheld, Benjamin Cherian +3 more | 2016-01-05 |