Issued Patents 2011
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8077900 | Microphone and method for fabricating the same | Masanori Minamio, Koji Nomura | 2011-12-13 |
| 7993980 | Lead frame, electronic component including the lead frame, and manufacturing method thereof | Toshiyuki Fukuda, Hisashi Umeda, Yasutake Yaguchi | 2011-08-09 |
| 7973412 | Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead | Seiji Fujiwara, Akio Furusawa, Kenichirou Suetugu | 2011-07-05 |
| 7971347 | Method of interconnecting workpieces | Leonel Arana, Rob Nickerson, Lim Chong Sim, Edward R. Prack | 2011-07-05 |
| 7960271 | Semiconductor device and method of manufacturing the same | Hideki Takehara, Seiji Fujiwara, Takahiro Nakano, Hikari Sano | 2011-06-14 |
| 7927997 | Flip-chip mounting method and bump formation method | Koichi Hirano, Seiji Karashima, Takashi Ichiryu, Seiichi Nakatani | 2011-04-19 |
| 7915697 | Sensor device and fabrication method for the same | Masanori Minamio | 2011-03-29 |
| 7915081 | Flexible interconnect pattern on semiconductor package | David Chau, Gregory M. Chrysler, Devendra Natekar | 2011-03-29 |
| 7910403 | Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same | Koichi Hirano, Seiji Karashima, Takashi Ichiryu | 2011-03-22 |
| 7882628 | Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias | Sriram Muthukumar, Raul Mancera, Chi Won Hwang | 2011-02-08 |
| 7868336 | Semiconductor device and method of manufacturing the same | Hiroaki Fujimoto | 2011-01-11 |