Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7882628 | Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias | Sriram Muthukumar, Yoshihiro Tomita, Chi Won Hwang | 2011-02-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7882628 | Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias | Sriram Muthukumar, Yoshihiro Tomita, Chi Won Hwang | 2011-02-08 |