Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030782 | Metal-metal bonding of compliant interconnect | Shriram Ramanathan | 2011-10-04 |
| 7882628 | Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias | Raul Mancera, Yoshihiro Tomita, Chi Won Hwang | 2011-02-08 |