Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7952203 | Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed thereby | — | 2011-05-31 |
| 7882628 | Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias | Sriram Muthukumar, Raul Mancera, Yoshihiro Tomita | 2011-02-08 |