Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7973412 | Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead | Seiji Fujiwara, Yoshihiro Tomita, Akio Furusawa | 2011-07-05 |