Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7973412 | Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead | Yoshihiro Tomita, Akio Furusawa, Kenichirou Suetugu | 2011-07-05 |
| 7960271 | Semiconductor device and method of manufacturing the same | Hideki Takehara, Yoshihiro Tomita, Takahiro Nakano, Hikari Sano | 2011-06-14 |