Issued Patents 2011
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071425 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Takashi Kitae, Yoshihisa Yamashita, Takashi Ichiryu, Seiji Karashima | 2011-12-06 |
| 8064213 | Module with a built-in component, and electronic device with the same | Toshiyuki Asahi, Seiji Karashima, Takashi Ichiryu, Tousaku Nishiyama | 2011-11-22 |
| 8063486 | Circuit board, method for manufacturing the same, and semiconductor device | Koichi Hirano, Tsukasa Shiraishi, Tatsuo Ogawa | 2011-11-22 |
| 8039307 | Mounted body and method for manufacturing the same | Toshiyuki Kojima, Yoshihisa Yamashita, Takashi Kitae, Shingo Komatsu | 2011-10-18 |
| 8012801 | Flip chip mounting process and flip chip assembly | Seiji Karashima, Yoshihisa Yamashita, Satoru Tomekawa, Takashi Kitae | 2011-09-06 |
| 7981528 | Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same | Yoshihisa Yamashita, Takashi Ichiryu, Koichi Hirano | 2011-07-19 |
| 7977741 | Manufacturing method of flexible semiconductor device and flexible semiconductor device | Koichi Hirano, Shingo Komatsu, Yoshihisa Yamashita, Takashi Ichiryu | 2011-07-12 |
| 7963310 | Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film | Tsukasa Shiraishi | 2011-06-21 |
| 7951700 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiji Karashima, Yoshihisa Yamashita, Takashi Ichiryu | 2011-05-31 |
| 7943518 | Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip | Koichi Hirano, Tetsuyoshi Ogura | 2011-05-17 |
| 7927997 | Flip-chip mounting method and bump formation method | Koichi Hirano, Seiji Karashima, Takashi Ichiryu, Yoshihiro Tomita | 2011-04-19 |
| 7921551 | Electronic component mounting method | Yoshihisa Yamashita, Seiji Karashima, Takashi Kitae, Toshiyuki Kojima, Shingo Komatsu | 2011-04-12 |
| 7919357 | Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates | Susumu Sawada, Seiji Karashima, Takashi Kitae | 2011-04-05 |
| 7911064 | Mounted body and method for manufacturing the same | Shingo Komatsu, Seiji Karashima, Toshiyuki Kojima, Takashi Kitae, Yoshihisa Yamashita | 2011-03-22 |
| 7905011 | Bump forming method and bump forming apparatus | Yasushi Taniguchi, Seiji Karashima, Takashi Kitae, Susumu Matsuoka, Masayoshi Koyama | 2011-03-15 |
| 7888789 | Transfer material used for producing a wiring substrate | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2011-02-15 |
| 7875496 | Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body | Seiji Karashima, Takashi Kitae, Yoshihisa Yamashita, Takashi Ichiryu | 2011-01-25 |