Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8012801 | Flip chip mounting process and flip chip assembly | Seiji Karashima, Yoshihisa Yamashita, Takashi Kitae, Seiichi Nakatani | 2011-09-06 |
| 7969741 | Substrate structure | Haruo Hayakawa, Masahiro Ono, Seiji Yamaguchi, Yoshihiro Uda, Kazuhiro Shinchi +7 more | 2011-06-28 |