Issued Patents 2011
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071425 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Seiichi Nakatani, Takashi Kitae, Yoshihisa Yamashita, Takashi Ichiryu | 2011-12-06 |
| 8064213 | Module with a built-in component, and electronic device with the same | Toshiyuki Asahi, Takashi Ichiryu, Seiichi Nakatani, Tousaku Nishiyama | 2011-11-22 |
| 8012801 | Flip chip mounting process and flip chip assembly | Yoshihisa Yamashita, Satoru Tomekawa, Takashi Kitae, Seiichi Nakatani | 2011-09-06 |
| 7951700 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiichi Nakatani, Yoshihisa Yamashita, Takashi Ichiryu | 2011-05-31 |
| 7927997 | Flip-chip mounting method and bump formation method | Koichi Hirano, Takashi Ichiryu, Yoshihiro Tomita, Seiichi Nakatani | 2011-04-19 |
| 7921551 | Electronic component mounting method | Yoshihisa Yamashita, Takashi Kitae, Seiichi Nakatani, Toshiyuki Kojima, Shingo Komatsu | 2011-04-12 |
| 7919357 | Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates | Susumu Sawada, Seiichi Nakatani, Takashi Kitae | 2011-04-05 |
| 7911064 | Mounted body and method for manufacturing the same | Shingo Komatsu, Seiichi Nakatani, Toshiyuki Kojima, Takashi Kitae, Yoshihisa Yamashita | 2011-03-22 |
| 7910403 | Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same | Koichi Hirano, Takashi Ichiryu, Yoshihiro Tomita | 2011-03-22 |
| 7905011 | Bump forming method and bump forming apparatus | Yasushi Taniguchi, Seiichi Nakatani, Takashi Kitae, Susumu Matsuoka, Masayoshi Koyama | 2011-03-15 |
| 7875496 | Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body | Seiichi Nakatani, Takashi Kitae, Yoshihisa Yamashita, Takashi Ichiryu | 2011-01-25 |