Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071425 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Seiichi Nakatani, Takashi Kitae, Yoshihisa Yamashita, Seiji Karashima | 2011-12-06 |
| 8064213 | Module with a built-in component, and electronic device with the same | Toshiyuki Asahi, Seiji Karashima, Seiichi Nakatani, Tousaku Nishiyama | 2011-11-22 |
| 7981528 | Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same | Seiichi Nakatani, Yoshihisa Yamashita, Koichi Hirano | 2011-07-19 |
| 7977741 | Manufacturing method of flexible semiconductor device and flexible semiconductor device | Koichi Hirano, Seiichi Nakatani, Shingo Komatsu, Yoshihisa Yamashita | 2011-07-12 |
| 7951700 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiichi Nakatani, Seiji Karashima, Yoshihisa Yamashita | 2011-05-31 |
| 7927997 | Flip-chip mounting method and bump formation method | Koichi Hirano, Seiji Karashima, Yoshihiro Tomita, Seiichi Nakatani | 2011-04-19 |
| 7910403 | Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same | Koichi Hirano, Seiji Karashima, Yoshihiro Tomita | 2011-03-22 |
| 7875496 | Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body | Seiichi Nakatani, Seiji Karashima, Takashi Kitae, Yoshihisa Yamashita | 2011-01-25 |