Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8063486 | Circuit board, method for manufacturing the same, and semiconductor device | Tsukasa Shiraishi, Seiichi Nakatani, Tatsuo Ogawa | 2011-11-22 |
| 7981528 | Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same | Seiichi Nakatani, Yoshihisa Yamashita, Takashi Ichiryu | 2011-07-19 |
| 7977741 | Manufacturing method of flexible semiconductor device and flexible semiconductor device | Seiichi Nakatani, Shingo Komatsu, Yoshihisa Yamashita, Takashi Ichiryu | 2011-07-12 |
| 7943518 | Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip | Tetsuyoshi Ogura, Seiichi Nakatani | 2011-05-17 |
| 7927997 | Flip-chip mounting method and bump formation method | Seiji Karashima, Takashi Ichiryu, Yoshihiro Tomita, Seiichi Nakatani | 2011-04-19 |
| 7910403 | Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same | Seiji Karashima, Takashi Ichiryu, Yoshihiro Tomita | 2011-03-22 |
| 7888789 | Transfer material used for producing a wiring substrate | Yasuhiro Sugaya, Shingo Komatsu, Seiichi Nakatani, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2011-02-15 |