Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967155 | Adhesion of copper and etch stop layer for copper alloy | Jing-Cheng Lin, Ching-Hua Hsieh, Shau-Lin Shue | 2005-11-22 |
| 6955952 | Strain balanced structure with a tensile strained silicon channel and a compressive strained silicon-germanium channel for CMOS performance enhancement | Yee-Chia Yeo, Chun-Chieh Lin, Fu-Liang Yang, Chenming Hu | 2005-10-18 |
| 6943111 | Barrier free copper interconnect by multi-layer copper seed | Jing-Cheng Lin, Cheng-Lin Huang, Winston Shue | 2005-09-13 |
| 6936530 | Deposition method for Si-Ge epi layer on different intermediate substrates | Liang-Gi Yao, Kuen-Chyr Lee, Shih-Chang Chen | 2005-08-30 |
| 6911369 | Discontinuity prevention for SiGe deposition | Kuen-Chyr Lee, Liang-Gi Yao, Fu Chin Yang, Shih-Chang Chen | 2005-06-28 |
| 6900269 | Halogen-free resin composition | Kuen-Yuan Hwang, An-Pang Tu, Chi-Yi Ju, Sheng Yen Wu, Chun-Hsiung Kao +1 more | 2005-05-31 |
| 6878610 | Relaxed silicon germanium substrate with low defect density | Chun Chich Lin, Yee-Chia Yeo, Chien-Chao Huang, Chao-Hsiung Wang, Tien-Chih Chang +4 more | 2005-04-12 |