Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967155 | Adhesion of copper and etch stop layer for copper alloy | Jing-Cheng Lin, Ching-Hua Hsieh, Mong-Song Liang | 2005-11-22 |
| 6949472 | Method for high kinetic energy plasma barrier deposition | Cheng-Lin Huang, Ching-Hua Hsieh | 2005-09-27 |
| 6884736 | Method of forming contact plug on silicide structure | Chii-Ming Wu, Mei-Yun Wang, Chih-Wei Chang, Chin-Hwa Hsieh, Chu-Yun Fu +3 more | 2005-04-26 |
| 6878615 | Method to solve via poisoning for porous low-k dielectric | Ming-Hsing Tsai, Jing-Cheng Lin, Chen-Hua Yu | 2005-04-12 |
| 6864143 | Eliminate bridging between gate and source/drain in cobalt salicidation | Mei-Yun Wang | 2005-03-08 |
| 6849543 | Cobalt silicide formation method employing wet chemical silicon substrate oxidation | Mei-Yun Wang, Chih-Wei Chang, Ching-Hau Hsieh | 2005-02-01 |