Issued Patents 2005
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977218 | Method for fabricating copper interconnects | Horng-Huei Tseng | 2005-12-20 |
| RE38914 | Dual damascene patterned conductor layer formation method without etch stop layer | Syun-Ming Jang | 2005-12-06 |
| 6958291 | Interconnect with composite barrier layers and method for fabricating the same | Horng-Huei Tseng, Syun-Ming Jang, Chenming Hu | 2005-10-25 |
| 6878615 | Method to solve via poisoning for porous low-k dielectric | Ming-Hsing Tsai, Jing-Cheng Lin, Shau-Lin Shue | 2005-04-12 |
| 6876082 | Refractory metal nitride barrier layer with gradient nitrogen concentration | Hsien-Ming Lee, Shing-Chuang Pan, Chung-Shi Liu | 2005-04-05 |
| 6876062 | Seal ring and die corner stress relief pattern design to protect against moisture and metallic impurities | Tze-Liang Lee, Shih Chung Chen, Ming-Soah Liang | 2005-04-05 |
| 6860769 | Cathode contact pin for an electroplating process | Chung-Shi Liu | 2005-03-01 |
| 6841466 | Method of selectively making copper using plating technology | Horng-Huei Tseng | 2005-01-11 |