Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6969675 | Method of forming multilayer diffusion barrier for copper interconnections | — | 2005-11-29 |
| 6967155 | Adhesion of copper and etch stop layer for copper alloy | Ching-Hua Hsieh, Shau-Lin Shue, Mong-Song Liang | 2005-11-22 |
| 6943111 | Barrier free copper interconnect by multi-layer copper seed | Cheng-Lin Huang, Winston Shue, Mong-Song Liang | 2005-09-13 |
| 6878615 | Method to solve via poisoning for porous low-k dielectric | Ming-Hsing Tsai, Shau-Lin Shue, Chen-Hua Yu | 2005-04-12 |
| 6864670 | Method for eliminating noise interference and acoustic noise by printed circuit board ground plane layout | Jr-Hong Ouyang, Hui-Chuan Lai | 2005-03-08 |