Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949472 | Method for high kinetic energy plasma barrier deposition | Ching-Hua Hsieh, Shau-Lin Shue | 2005-09-27 |
| 6943111 | Barrier free copper interconnect by multi-layer copper seed | Jing-Cheng Lin, Winston Shue, Mong-Song Liang | 2005-09-13 |