Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6943111 | Barrier free copper interconnect by multi-layer copper seed | Jing-Cheng Lin, Cheng-Lin Huang, Mong-Song Liang | 2005-09-13 |
WS
Winston Shue
Overall (2005): #75,745 of 245,428Top 35%
1
Patents 2005