Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967155 | Adhesion of copper and etch stop layer for copper alloy | Jing-Cheng Lin, Shau-Lin Shue, Mong-Song Liang | 2005-11-22 |
| 6949472 | Method for high kinetic energy plasma barrier deposition | Cheng-Lin Huang, Shau-Lin Shue | 2005-09-27 |
| 6927498 | Bond pad for flip chip package | Tai-Chun Huang, Chih-Hsiang Yao | 2005-08-09 |